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Saturday, 21-Feb-2026 21:27:26 GMT Z88 Projects 1M / 512K FLASH / 1M RAM PCBupdated 11th July 2013Contents
It has now been ten
years since the last Printed Circuit Board
(PCB) was designed to use the Intel Flash chip.
During that time we have seen Intel withdraw that chip and AMD bringing
out a version which we have used ever since. Spansion took over AMD but
they now have announced they have stopped manufacturing these range of
chips. Stocks of the previous flash chips and PCBs are running low, so
Rakewell bought the remaining stocks of 1M and 512K AMD Flash chips. |
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| When the Z88 was manufactured in
1988, a 32K EPROM chip (for example) took up half the space of the PCB
and had big pins to solder. Chip sizes now are a lot smaller and use Surface-mount technology. |
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Why not make one multifuctional card that share the
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It was decided that we could design a card to do FOUR functions.
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Detail| Table | U1 | U2 | U3 | U4 | C1 | C2 / 6 | C3 / 7 | C4 / 5 | C8 | LK1 | LK2 | D1 | R1 |
| 1M RAM | ![]() | ![]() | ![]() | ![]() | |||||||||
| 1M FLASH | ![]() | ![]() | ![]() | ![]() | ![]() | ||||||||
| 512K FLASH | ![]() | ![]() | ![]() | ![]() | |||||||||
| 512K RAM / 512K FLASH | ![]() | ![]() | ![]() | ![]() | ![]() | ![]() | ![]() |
Design Notes
Placing the components![]() | The
512K Flash U3 lent itself to be placed on the right-hand side of the
board as the chip pinouts are simular to the old style DIL chips. I originally ran the red tracks towards the outside of the board underneath the green tracks, thinking that the inside of the chip would be crowded, but this was not to be the case. |
| The Chip Select U4 was placed at the bottom left because A19 was that side of the Z88 Connector. On reflection it wouldn't have mattered which side it went on as A19 also goes to U1 1M Flash. This is why the LED was placed on the right-hand side (after this picture was taken). The links select either the 1M RAM or the 512K Flash when the 512K RAM / 512K Flash and the Chip Select U4 is not used. |
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| Underneath the PCB the Configuration table was added. The decoupling capacitors were also placed here as well as on the component side. This was done just in case there was not enough room here for them. In the case of R1, if there is not enough space for it, it may have to be hard wired to the LED on the component side. |
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| In v1, the configuration table was moved up to the unused connector area for clarity. |
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512K RAM / 512 Flash cardUsing the Test Points |
Testing the chips individually.
|
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| This diagram shows the procedure used when deselecting either the 512K Flash (shown in GREEN) or the 1M RAM (shown in RED) after testing it. (Note the position of Vcc has been changed in v1). A small length of wire is used to connect Vcc to the right hand side pad of the device that needs to be deselected. |
1M Flash chip only |
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| The LED (D1) will come on when is actively erasing or programming. (This includes programming in the Erase Suspend mode.) If the output is high (LED off), the flash chip is ready to read array data (including during the Erase Suspend mode), or is in the standby mode. |
Function |
Default |
Notes |
Used |
Explanation |
| Copper to copper-fill clearance | 10 | 15 | is the clearance that FreePCB will create around traces or vias that pass through copper layers. | |
| Hole-edge to copper-fill clearance | 15 | 17 | is the clearance that will be created around drill holes. Please refer to Section 5.194: Drill Clearances for an important note about these clearances. | |
| Solder mask clearance | 8 | The pitch of the smallest chip is 1.27mm (50 mil) | 4 | the space that FreePCB will provide around pads in the solder masks. |
| Pilot hole diameter | 10 | 10 | the diameter of the pilot holes, if you selected them. Unable to change. | |
| Minimum silkscreen stroke width | 5 | Check | 5 | the minimum stroke width that FreePCB will use for the silkscreen layers, which is usually recommended by the board house. |
| Thermal relief line width | 10 | 10 | the width of the lines that will be used to connect pads or vias to copper fill areas using thermal reliefs. | |
| Board outline line width | 5 | 5 | the width of the board outline, if used. | |
| Annular ring width (pins) | 7 | 7 | ||
| Annular ring width (vias) | 5 | 5 |
Post Production Errors| The Vpp needs to be disconnected |
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| The /CE needs to be connected to the 1M flash chip. |
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Version 1
Parts List & History21/07/2009 Spansion are no longer manufacturing these chips - Rakewell buys up existing Farnell stock of 1M Flash.
13/11/2009 No more AMD 512K Flash chips from Farnel - considering AMIC - Programming change required.
01/12/2009 Rakewell locates part and buys up stock of AMD 512K Flash chips.
12/01/2010 Rakewell places order for the PCBs!
13/01/2010 Gunther points me to the places in the source code to add different Flash devices -
17/04/2010 Spansion manufactures 1M & 512K Flash chips (1M out of stock) AMIC Chips work.
04/12/2010 Low on stock of pre-production PCB. Work on Version 1 begins.
07/12/2010 Order placed for new batch of PCBs.
31/05/2013 Order placed for new batch of PCBs
10/07/2013 Problem with the Lyontek memory chip
Order |
Chip
|
Description |
pdf data sheet |
U1
|
AM29F080B-90ED 1Mx8 |
http:// |
|
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U1 | AMD - | http://www.spansion.com/ |
1488943 |
U2
|
BS62LV8001EIP55 - |
http://www.farnell.com/ |
2253667 |
U2
|
LYONTEK - |
http://www.farnell.com/ |
1791222 |
U3 | SPANSION - | |
1791218 |
U3 |
SPANSION - |
http://www.farnell.com/ |
1565992 |
U3
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AMIC - |
|
1085333 |
U4
|
74HC/HCT139 |
http://www.farnell.com/ |
1190107 |
C1
|
10uF Surface Mount |
http://www.farnell.com/ |
1288282 |
C2-8
|
0.1uF Case style: |
http://www.farnell.com/ |
1525564 |
D1 | SLR-56VR3F — ROHM | http://www.farnell.com/ |
1108764RL |
R1 | PCF0402-R-220R-B-T1. | http://www.farnell.com/ |
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8749493
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FLASH 5V 4MB, | ||
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